11.Components, Packaging, and Manufacturing Technology by John G. Webster (Editor) PDF

By John G. Webster (Editor)

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SIMULATION OF SIGNAL TRANSMISSION Simulation of signal transmission on interconnections may involve lumped models in the form of networks composed of resistors R, inductors L, and capacitors C; distributed models of perfect interconnections in the form of lossless transmission lines; and distributed models of imperfect interconnections in the form of lossy transmission lines. The computational efforts in simulation of signal transmission in lumped models are insignificant, but they are very significant in the case of lossy transmission line models.

However, mixtures of different parti- cle sizes allow denser packing of the particles without the particle-to-particle contact, which defines the limit of loading. Models guide the formulators toward maximizing the loading while maintaining the minimum viscosity (1,2). Spherical particles have less surface area and less hydrodynamic drag than angular particles thereby reducing the viscosity. However, they are less effective at reinforcing the cured matrix, especially against crack growth fracture.

To emphasize this difference, they are sometimes called Maxwell capacitances. The structure inductances are computed using the fact that the product of inductance and capacitance matrices for the same conductor structure formed in vacuum satisfies the relation LC0 ϭ (1/ ␯2)E, where C0 is the capacitance matrix computed under the assumptions that all dielectric constants are unity (this corresponds to the replacement of dielectrics by vacuum), ␯ is the velocity of light in vacuum, and E is the unity matrix.

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11.Components, Packaging, and Manufacturing Technology by John G. Webster (Editor)

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